发明名称 |
Layer Between Interfaces of Different Components in Semiconductor Devices |
摘要 |
A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.
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申请公布号 |
US2007205518(A1) |
申请公布日期 |
2007.09.06 |
申请号 |
US20070692322 |
申请日期 |
2007.03.28 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BAUER MICHAEL;HAIMERL ALFRED;HOSSEINI KHALIL;KESSLER ANGELA;MAHLER JOACHIM;SCHOBER WOLFGANG |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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