摘要 |
A side key assembly for an electronic device and a manufacturing method thereof are provided to reduce pollutants by using a polycarbonate resin or an acryl resin for a plastic mold. A side key assembly(142) for an electronic device includes a rubber contact(144) and a plastic mold(146). The rubber contact is contacted with a metal dome which is formed on a PCB(Printed Circuit Board) of the electronic device. The rubber contact delivers signals. The plastic mold contains the rubber contact at a rear surface thereof and is protruded from one surface of an electronic device cover. The rubber contact is made of a silicon rubber. A symbol, a letter, or a combination thereof is engraved on a rear surface of the plastic mold. The plastic mold is a polycarbonate resin or an acryl resin.
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