| 摘要 |
PROBLEM TO BE SOLVED: To prevent the short circuit in a connection location of a wiring board to which a semiconductor chip is wire-bonded. SOLUTION: In the wiring board such as FPC5 having a plurality of wiring patterns 8 formed on the surface thereof, a plated portion 9a is formed in the wire connection of a land 9 of the wiring pattern 8 so that the surface of the plated portion 9a will be higher than the surrounding area thereof. According to this configuration, even if a wire 13 connected to the plated portion 9a of a certain wiring pattern 8 hangs down, it will not have the possibility of coming in contact with the lower portion of another wiring pattern 8 on the frontward side of it, so that the short circuit can be prevented. COPYRIGHT: (C)2007,JPO&INPIT
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