| 摘要 |
PROBLEM TO BE SOLVED: To reduce damage against the surface of a semiconductor substrate in a wet processing. SOLUTION: A method for manufacturing a semiconductor device contains a process for supplying the rear of the semiconductor substrate 10 forming an element on a surface with first conductive chemicals 50. The manufacturing method further contains the process for supplying the surface of the semiconductor substrate 10 with second conductive chemicals 52, and conducting the wet processing after the process supplying the first chemicals 50 is started. COPYRIGHT: (C)2007,JPO&INPIT
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