WAFER HOLDING BODY AND WAFER PROBER MOUNTED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wafer holding body capable of realizing probing with a small amount of noise or nearly without noise by cutting off electromagnetic waves to a wafer, and to provide a wafer probe apparatus for mounted with the wafer holding body. SOLUTION: The wafer holding body comprises: a chuck top 1 for placing wafers; and a resistive electrical heating element 3 for heating the chuck top 1. The resistive electrical heating element 3 is covered with an insulating layer at least partially, and a conductive layer 2 is provided at a side opposite to the resistive electrical heating element 3 in the insulating layer. The conductive layer 2 cuts off electromagnetic waves for poorly affecting inspection. Preferably, the insulating layer covers the entire surface of the resistive electrical heating element 3 and the conductive layer 2 covers the entire surface of the resistive electrical heating element 3 containing the insulating layer. COPYRIGHT: (C)2007,JPO&INPIT