| 摘要 |
PROBLEM TO BE SOLVED: To solve the matter in a semiconductor circuit having interconnections running in parallel on a substrate that propagation timing of a signal may be different between the interconnections due to accumulation of delay caused by insertion of a plurality of buffers. SOLUTION: With regard to two interconnections running in parallel where at least one interconnection bends, the bending is specified such that the crosstalk occurring between these two interconnections becomes smaller than the crosstalk occurring between two interconnections where at least one interconnection is not bending. COPYRIGHT: (C)2007,JPO&INPIT
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