发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition that has a small expansion coefficient at the time of water absorption and a small coefficient of thermal expansion, as well as high impact strength, rigidity, electroconductivity, adhesiveness of a coating film, and moldability, and to provide an automotive exterior part comprised of the polyamide resin composition. SOLUTION: The polyamide resin composition comprises (A) a 35-90 wt.% polyamide resin, (B) a 5-35 wt.% impact resistance improving agent, (C) a 1-30 wt.% non-fibrous filler, wherein the sum amount of (A)-(C) is 100 wt.%, and the polyamide resin (A) comprises (A1) a 20-80 wt.% hexamethylene sebacamide unit obtained from sebacic acid and hexamethylene diamine, (A2) an 80-20 wt.% hexamethylene terephthalamide unit obtained from terephthalic acid and hexamethylene diamine, and (A3) a copolyamide resin. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007224288(A) 申请公布日期 2007.09.06
申请号 JP20070013889 申请日期 2007.01.24
申请人 TORAY IND INC 发明人 INABA HAJIME;KAWAKAMI KOJI;YAMADA MOTONOBU;NAKASE MICHIYUKI
分类号 C08L77/06;C08K3/04;C08K3/34;C08K9/04 主分类号 C08L77/06
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