| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors, excellent in low stress property and excellent also in high-temperature storage characteristic and reliability on moisture resistance and soldering resistance. SOLUTION: In the epoxy resin composition comprising (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a liquid low-stress agent containing a butadiene-acrylonitrile copolymer having a carboxyl groups at both ends as a main component, (F) a non-phosphorus-based antioxidant is further included. The semiconductor device is obtained by sealing a semiconductor element with a cured material of the resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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