发明名称 Conductive Resin Composition
摘要 Disclosed is a conductive resin composition containing a polyamide, a polyphenylene ether, a polyester and a conductive carbon filler. The resin composition has attained excellent conductivity by being added with a small amount of the conductive carbon filler, while being excellent in fluidity and surface luster. Also disclosed is a molded body formed from such a resin composition.
申请公布号 US2007205401(A1) 申请公布日期 2007.09.06
申请号 US20050593496 申请日期 2005.04.13
申请人 发明人 TERADA KAZUNORI;MIYOSHI TAKAAKI
分类号 H01B1/24;C08J3/22;C08K3/04;C08L67/00;C08L71/12;C08L77/00;C08L77/02;C08L77/06 主分类号 H01B1/24
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