摘要 |
PROBLEM TO BE SOLVED: To provide a magnetron sputtering device capable of obtaining a target of high utilization efficiency. SOLUTION: The magnetron sputtering device comprises a cathode 4 which is located in a vacuum chamber 2 to hold a target 3, an anode 6 for holding a substrate 5 facing the target 3 side of the cathode 4, and a magnet unit 7 located below the cathode 4 for generating the magnetic field. The magnet unit 7 comprises a permanent magnet 12 fixed to the outer circumference of a base 10, a plurality of electromagnets 11A-11D arranged substantially at the center of the base 10, and having a plurality of cores with coils 14 wound therearound, a current supply source E for supplying the current to the coils 14, and a switching unit SW for connecting the current supply source E to any one of the coils 14 wound around the core 13. COPYRIGHT: (C)2007,JPO&INPIT
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