METHOD FOR MANUFACTURING LED PACKAGE AND WHITE LIGHT SOURCE MODULE

摘要

A method for manufacturing an LED package and a method for manufacturing a white light source module are provided to coat uniformly a fluorescent thin film on a resin molding portion by using a spray coating method. A resin molding portion(108) is formed on an LED chip(105) mounted on a circuit board to seal the LED chip. A coating agent comprising fluorescent substance is applied on a surface of the resin molding portion through a spray coating method to form a fluorescent thin film(120) on the surface of the resin molding portion. In the step of forming a fluorescent thin film, the coating agent is sprayed on the resin molding portion in a spray pattern of conical swirl.