| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate surface-treating device and a substrate surface treatment method capable of treating a substrate efficiently, and to provide a substrate-treating device capable of treating the substrate efficiently without increasing footprint. SOLUTION: Fluoric acid vapor is supplied onto the surface of the substrate W by a fluid umbrella nozzle 22 in the etching treatment of an oxide film formed on the substrate W. For rinsing treatment after the etching treatment, a rinse nozzle 43 is provided, which supplies hot water or vapor as a rinsing liquid toward the surface of the rotated substrate W. The temperature of hot water or vapor supplied by the rinse nozzle 43 is nearly the same as (for example, not less than 30°C and not more than 90°C) that of the substrate W heated by a hot plate 21. In the drying treatment of the substrate W, high-temperature nitrogen gas is supplied via one or both of the fluid umbrella nozzle 22 and a space 41 in a rotating shaft 25. COPYRIGHT: (C)2007,JPO&INPIT
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