| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin having excellent adhesion to lead frames, especially lead frames subjected to a nickel/palladium/gold (Ni/Pd/Au) plating treatment and having excellent soldering resistance and a reduced impurity content. SOLUTION: The semiconductor sealing epoxy resin composition comprises the following components (A) to (D): (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a triazinethio group-containing compound, provided that the content of the component D triazinethio group-containing compound is set within the range of 0.0015 to 0.6 wt.% based on the entire epoxy resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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