PROCESS FOR FABRICATING CIRCUIT ASSEMBLIES USING ELECTRODEPOSITABLE DIELECTRIC COATING COMPOSITIONS

摘要

PROBLEM TO BE SOLVED: To provide a process for fabricating multilayer circuit assembles including dielectric coating formed by electrodeposition to form metalized vias. SOLUTION: This invention is related to a process of forming metalized vias in a substrate. This process includes (I) a step of depositing electrodepositable coating composite onto all exposed surfaces of the substrate to form a conformable dielectric coating on the conductive substrate. The electrodepositable coating composite contains a resinous phase dispersed in an aqueous phase and the resinous phase contains (a) an ion group containing resin including non-gel active hydrogen and (b) a curing agent which react to the active hydrogen in the resin (a). The resinous phase contains at least 1 wt.% of covalently bonded halogen. COPYRIGHT: (C)2007,JPO&INPIT