发明名称 FLEXIBLE WIRING BOARD, ITS SOLDER BONDING METHOD AND OPTICAL TRANSMITTING PACKAGE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring board and its solder bonding method by which electrodes can be bonded to each other by solder without producing a corrosive gas, and to provide an optical transmitting package using the same. SOLUTION: The flexible wiring board 1 is comprised of a conductor 3 formed directly on a flexible heat-resistance insulation film 2, a wiring which is formed by covering such a film 41 as a nickel oxide film or the like on the conductor 3 that is difficult to be wetted by solder, and an electrode 5 which is formed by covering the surface of the wiring with such a film 51 that is easy to be wetted by solder such as gold or the like. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007227452(A) 申请公布日期 2007.09.06
申请号 JP20060044041 申请日期 2006.02.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 HAMAGUCHI TSUNEO;SUGIDACHI ATSUSHI;KOGURE TAICHI;NISHIMURA YASUNORI
分类号 H05K3/34 主分类号 H05K3/34
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