发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve the operation rate of a substrate processing apparatus using a liquid material by facilitating a maintenance work, shortening a working time and prolonging a maintenance period by allowing a deposited matter to be removed without detaching a vaporization unit. SOLUTION: The apparatus is provided with a processing chamber 26 for housing a substrate 11; a gas supplying means for supplying a desired gas to the processing chamber; a gas discharging means 53 for discharging the atmosphere in the processing chamber; and an evaporating unit 35 forming one part of the gas supplying means, and vaporizing the raw material in a liquid state at a room temperature. The vaporizing unit is provided with a vaporization space; a heating section for heating the vaporization space; a reservoir for preserving the deposit produced from the raw material; and a discharging section for discharging the deposit preserved in the reservoir. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007227471(A) 申请公布日期 2007.09.06
申请号 JP20060044261 申请日期 2006.02.21
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 HOTTA TOMOKI
分类号 H01L21/31;C23C16/448 主分类号 H01L21/31
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