发明名称 Semiconductor device, semiconductor wafer, and methods of producing same device and wafer
摘要 A method of forming a multi-layered insulation film includes forming a first insulation layer using a first feed gas, the first insulation layer including methyl silsesquioxane (MSQ), forming a second insulation layer using a second feed gas, the second insulation layer including a polysiloxane compound having an Si-H group such that the second insulation layer is in contact with a top of the first insulation layer, and forming a third insulation layer including an inorganic material such that the third insulation layer is in contact with a top of the second insulation layer.
申请公布号 US2007207610(A1) 申请公布日期 2007.09.06
申请号 US20070797293 申请日期 2007.05.02
申请人 NEC ELECTRONICS CORPORATION 发明人 USAMI TATSUYA
分类号 C23C16/30;H01L21/4763;H01L21/312;H01L21/316;H01L21/318;H01L21/60;H01L21/768;H01L23/522;H01L23/532 主分类号 C23C16/30
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