| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounting LED component capable of efficiently dissipating the generation of heat of an LED chip while being excellent in productivity, and to provide its manufacturing method. <P>SOLUTION: The LED component is constituted of a radiating plate 7, the LED chip 4 mounted on the radiating plate 7, and a wiring substrate 1 electrically connected to the LED chip 4 and made of ceramic. The wiring substrate 1 is provided with a through-hole 12 at an arbitrary position, and the radiating plate 7 with the LED chip 4 mounted thereon is provided in the through-hole 12. The radiating plate 7 is connected to the wiring substrate 1, and the LED chip 4 as well as a wiring pattern 13 on the wiring substrate 1 are electrically connected through a connecting means and are buried by transparent resin 6. In such an LED component, a metallic material is employed for the connecting means of the radiating plate 7 and the wiring substrate 1. <P>COPYRIGHT: (C)2007,JPO&INPIT |
