| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg for producing an insulation layer suitable for a printed circuit board required to have a heat radiation property corresponding to a large electric current and the loading of heat-generating part. SOLUTION: This prepreg for heat-and press-molding, in which a thermosetting resin composition containing an inorganic filler held by a glass cloth substrate material is made as a semi-cured state. The inorganic filler consists of at least the following≥2 components of (1), (2). (1) A scale-formed filler having 1≤d1≤20μm range mean particle diameter d1 of the filler particles in a plane surface direction, (2) A particle-formed filler having 0.1≤d2≤30μm range mean particle diameter d2. The inorganic filler is a thermosetting resin composition incorporated with the component (1) by 10 to 60 vol.% and the component (2) by 10 to 60 vol.% and 20 to 80 vol.% total content of the inorganic filler based on the volume of coupling the thermosetting resin solid portion and inorganic filler. Also, the glass substrate material has 0.02 to 0.2 mm<SP>2</SP>amount of mesh opening. COPYRIGHT: (C)2007,JPO&INPIT |
