| 摘要 |
PROBLEM TO BE SOLVED: To provide a hermetic seal apparatus for an electronic component capable of improving the productivity and the quality thereof. SOLUTION: This hermetic seal apparatus 1 comprises a control processor 11 and a hermetic chamber 12. A heater 12a and a sealing jig 12b installed on the heater 12a are provided in the hermetic chamber, and a temperature sensor 12c such as a thermocouple etc. is also mounted on the heater 12a. A control unit 11a, a pump 11b and a power supply are provided in the control processor 11. One or more sets of an input/output interface (terminals for control) for carrying out electric control and a piping interface (piping port) for controlling the atmosphere are provided in the control processor 11. An additional hermetic chamber (additional unit) is connected via respective interfaces, and the operation thereof is controlled. COPYRIGHT: (C)2007,JPO&INPIT
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