发明名称 METHOD AND DEVICE FOR CONTROLLING TEMPERATURE OF DIE
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for controlling the temperature of a die, which stably cool a die to a desired temperature. SOLUTION: In the method, a liquid release agent is sprayed to predetermined portions of a fixed die 2 and a movable die 3 while measuring the surface temperature of a predetermined portion of the molding surface of the movable die 3 with a radiation thermometer 4. When the measured surface temperature reaches a predetermined temperature, the spraying of the liquid release agent to the predetermined portions is halted. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007222890(A) 申请公布日期 2007.09.06
申请号 JP20060045150 申请日期 2006.02.22
申请人 AISIN SEIKI CO LTD 发明人 TODA MASATAKA
分类号 B22D17/20;B22C9/06;B22C23/02;B22D17/22 主分类号 B22D17/20
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