| 摘要 |
A wafer holder is provided having high rigidity and an enhanced heat-insulating effect that allow positional accuracy and heating uniformity to be improved, a chip to be rapidly heated and cooled, and the manufacturing cost to be reduced, and a wafer prober apparatus on which the wafer holder is mounted. The wafer holder of the present invention includes a chuck top for mounting a wafer, a support member for supporting the chuck top, and a stand for supporting the support member. The chuck top has a thermal conductivity K 1 and a Young's modulus Y 1 ; the support member has a thermal conductivity K 2 and a Young's modulus Y 2 ; and the stand has a thermal conductivity K 3 and a Young's modulus Y 3 . K 1 >K 2 and K 1 >K 3 ; and Y 3 >Y 1 and Y 3 >Y 2.
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