发明名称 Substrate processing method, semiconductor device and method for fabricating the semiconductor device
摘要 A method for processing semiconductor includes: forming a first insulation film containing silicon on a surface of a GaN-base semiconductor layer; and removing the first insulation film formed on the surface of the GaN-base semiconductor layer. The composition ratio of Ga and N on the surface of the GaN-base semiconductor layer can be approximated to the stoichiometrical composition ratio.
申请公布号 US2007207626(A1) 申请公布日期 2007.09.06
申请号 US20070712987 申请日期 2007.03.02
申请人 EUDYNA DEVICES INC. 发明人 NISHI MASAHIRO
分类号 H01L21/31 主分类号 H01L21/31
代理机构 代理人
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