| 摘要 |
A camera module is provided to simplify a manufacturing process and reduce a defect generation rate in each manufacturing stage of an image sensor chip, an image sensor module and a camera module by removing a back grinding process of the image sensor chip. An image sensor package(140) includes a transparent substrate, a metal wiring formed on the transparent substrate, an image sensor chip electrically connected to the metal wiring by a flip chip solder joint and formed at a lower portion of the transparent substrate, and a connection terminal(147) connected to the metal wiring and formed to an outside of the image sensor chip. A chip housing groove(110r) for housing the image sensor chip is formed on a printed circuit board(110) and the image sensor package is mounted on the printed circuit board. The connection terminal is located between the transparent substrate and the printed circuit board, and not protruded more largely than the image sensor chip.
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