FILM STRUCTURE IN DICING LINE, WAFER FOR OPTICAL SUBSTRATE, OPTICAL COMPONENT, AND METHOD OF MANUFACTURING OPTICAL COMPONENT

摘要

PROBLEM TO BE SOLVED: To eliminate problems that a long time is required to remove a photoresist film formed on the surface of an optical substrate wafer in a step for forming a dicing line formed of an optical film with a liquid remover and the residue of the photoresit remains on orientation flat surface in the formation of a plurality of optical component chip areas and the dicing lines for dividing between the chip areas on the wafer surface by a photolithography technology.

SOLUTION: The dicing line 1 is film-formed to divide and form the plurality of the optical component chip areas 2 on the surface of the optical substrate wafer W with a material the same as that used for the formation of the optical thin film on the optical component chip areas. The optical thin film constituting the dicing line is formed from a plurality of discontinuously arranged short optical thin films 20.

COPYRIGHT: (C)2007,JPO&INPIT