| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide inexpensively a circuit module based on a new package design which can be utilized in either application of high or low power. <P>SOLUTION: A semiconductor device module has an upper surface and a bottom surface, and is provided with: a support base (5) in which an opening which extends from the upper surface to the bottom surface is formed; a heat conductive substrate (22) which is arranged in the opening of the support base so as to be contact with a heatsink (21); at least one circuit board (27) which is arranged above the upper surface of the support base and in which an opening is formed so as to face directly above the heat conductive substrate; another device which is arranged on the circuit board; a bonding wire (40) which connects the semiconductor device to the bonding wire; and a cover (25) which is located on the opening of the circuit board. In order to reduce RFI noise emitted from at least one bonding wire, a conductive shielding material is provided in the cover (25). <P>COPYRIGHT: (C)2007,JPO&INPIT |
