| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of such a structure that air bubbles are less generated within an underfill resin between a wiring board and a semiconductor chip, and also a method of manufacturing the semiconductor device. <P>SOLUTION: The semiconductor device at least includes a board core made of an insulating material, a metallic wiring pattern formed on the first surface of the board core, a solder resist film for covering the wiring pattern, a wiring board of a rectangular shape having openings as slots provided in the solder resist film and having a plurality of elongate wiring lines arranged in parallel at the bottoms of the openings, a semiconductor chip flip-chip connected to the wiring lines arranged at the bottom of the wiring board, and an underfill resin buried in a gap between the wiring board and the semiconductor chip. In the semiconductor device, the openings are extended along four sides of the wiring board, and the wiring lines are extended along the width directions of the openings. Edges of the opening as a pair of long sides thereof are formed to be zigzag so that the width of the opening appears to be alternately long and short repetitively, edges of the zigzag-edged opening recessed toward the outside of the widthwise direction of the zigzag-edged opening correspond to the surfaces of the wiring lines, and projected parts of the opening extruded toward the inside of the width of the zigzag-edged opening. <P>COPYRIGHT: (C)2007,JPO&INPIT |
