| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device PD in which design of the wiring pattern of a wiring board can be facilitated for mounting the semiconductor device. <P>SOLUTION: When a plurality of semiconductor devices PD having different output current, and the like, are manufactured, arrangement and the number of leads 8A for electrically connecting the semiconductor chip 4C for the control circuit of the semiconductor device PD are set commonly, and arrangement and the number of leads 8B for electrically connecting the semiconductor chips 4PH and 4PL for the power transistor of the semiconductor device PD are varied depending on the output current, and the like, required for that semiconductor device PD. Since the potential of malfunction of the control circuit (PWM circuit) of the semiconductor device PD can be reduced, a semiconductor device PD is obtained in which design of the wiring pattern of a wiring board for mounting the semiconductor device can be facilitated. <P>COPYRIGHT: (C)2007,JPO&INPIT |
