| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability of hermetical sealing in the hermetical sealer of a package for a semiconductor device that is comprised of a dielectric multilayer substrate and a metallic ring. <P>SOLUTION: In a dielectric multilayer substrate 1, a cavity is provided at its center to mount a semiconductor device thereto, and an annular grounding conductor layer 2 for soldering a seal ring 5 is provided in large width around the cavity. An annular dielectric pattern 3 with small pattern width is provided around the seal ring 5 in the grounding conductor layer 2, so as to control the position of a fillet end of a solder material that is joined with the seal ring. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
