发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which the wiring body section can be cut and separated easily and surely at a coupling section (formed between the wiring body section and a disposable board section, or between the wiring body sections). SOLUTION: The multilayer printed wiring board 1 comprises a wiring body section Aw constituted by laminating a plurality of wiring substrates (wiring substrates 10, 20 and 21), and a coupling section Ac formed by extending the wiring substrate 10, and coupled with the disposable board section Ad arranged contiguously to the periphery of the wiring body section Aw through the coupling section Ac thus constituting a work to be processed. The wiring body section Aw is constituted of a flexible wiring substrate 10 and hard (or flexible) wiring substrates 20, 21, and the coupling section Ac is constituted of a flexible wiring substrate 10. The number of layers of wiring substrate in the coupling section Ac is set smaller than the number of layers of wiring substrate in the wiring body section Aw. An equilateral trapezoid 3 (hole) is formed in the separation line DLd of the coupling section Ac. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007227647(A) 申请公布日期 2007.09.06
申请号 JP20060047024 申请日期 2006.02.23
申请人 SHARP CORP 发明人 UENO YUKIHIRO
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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