发明名称 ELECTRONIC APPARATUS HAVING BOARD ARRANGEMENT STRUCTURE OF HIGH HEAT DISSIPATION EFFICIENCY
摘要 PROBLEM TO BE SOLVED: To provide a board arrangement structure having high efficiency for dissipating heat from heat generating components and the like. SOLUTION: A power supply board 8 is arranged in the upper space of an MPEG board 6 and a noise-eliminating shield 7 in a stacking manner with a gap, while a DVD unit 9 having legs is arranged in front thereof. By positioning a cooling fan 5 so as to make its rotation axis lie in the extension of the bottom surface of the DVD unit 9, a wind path can be formed from the underneath of the DVD unit 9 to the cooling fan 5 through the upper space of the power supply board 8 as well as through the gap. Furthermore, by arranging a switching transformer 81 and an IC 82 working as heat generating components mounted on the power supply board 8 within the extension lines of right and left ends of the cooling fan 5, the cooling wind flowing through the wind path can efficiently blow the heat generating components. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007227858(A) 申请公布日期 2007.09.06
申请号 JP20060050250 申请日期 2006.02.27
申请人 ORION DENKI KK 发明人 MOCHIZUKI MASAYUKI;MIKI TORU;TAKAMURA YUJI
分类号 H05K7/20 主分类号 H05K7/20
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