| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is possible to make good a solder bump formed in a resin insulation layer (solder resist layer), serving for high density wiring and high pin-count. SOLUTION: The wiring board 1 is equipped with a wiring lamination L1 having a main surface CP and a solder resist layer SR1. The thickness of the solder resist layer SR1 is made to be more than 25μm, an exposure opening 9 is provided to expose a conductor pad 10 formed in the main surface CP of the wiring lamination portion L1 in the solder resist layer SR1, a solder bump 11 connected to the conductor pad 10 is formed in the exposure opening 9, the inside wall 9c of the exposure opening 9 is a tapered plane whose diameter becomes large as it goes toward the opening side in the direction of the board thickness, and the difference in diameter of the tapered plane is more than 5μm between the upper surface 9a of the exposure opening 9 and the bottom surface 9b of the exposure opening 9. COPYRIGHT: (C)2007,JPO&INPIT
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