| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel epoxy resin composition that gives a cured product excellent in thermal shock resistance and moisture resistance reliability and is suitably used as one for sealing a semiconductor that affords a semiconductor device assuring high reliability even when surface-mounted on a circuit board, and a semiconductor device sealed with a cured product of the resin composition. SOLUTION: The epoxy resin composition comprises as essential ingredients (A) an epoxy resin, (B) a curing agent, (C) a silicone-modified phenolic resin represented by average compositional formula (1) (wherein R<SP>1</SP>is a hydrogen atom, a 1-4C alkyl group or a 1-6C organoxy group; X is a bivalent organic group; and Z is a bivalent organic group having an organosiloxane structure). The epoxy resin composition gives a cured product excellent in moldability as well as in thermal shock resistance and moisture resistance reliability. The semiconductor device sealed with the cured product of the epoxy resin composition exhibits excellent thermal shock resistance and moisture resistance reliability. COPYRIGHT: (C)2007,JPO&INPIT
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