| 摘要 |
Electronic component ( 1; 20 ) has at least one stack ( 2; 21, 23 ) with at least two semiconductor chips ( 8, 9; 32, 33; 42, 43 ). Each semiconductor chip ( 8, 9; 32, 33; 42, 43 ) includes an active surface including integrated circuits ( 11; 35 ) and chip contact pads ( 10; 34 ) at least one being a ground cell ( 13; 37 ) and a passive surface. The electronic component ( 1; 20 ) further includes at least one intermediate spacer ( 14; 38; 44 ) with a thermally conductive and electrically conductive material. The intermediate spacer block ( 14; 38; 44 ) is positioned between the active surface of a semiconductor chip ( 9; 33; 43 ) and the passive surface of an adjacent semiconductor chip ( 8; 32; 42 ) in the stack ( 2; 21, 23 ). The intermediate spacer ( 14; 38; 44 ) and the ground cells ( 13; 37 ) of the semiconductor chips ( 9; 33; 43 ) are electrically connected and have a common ground. |
