| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a delivery slip capable of contributing to achievement of high efficiency of delivery work and preventing erroneous matching of input information by utilizing an IC chip. <P>SOLUTION: In this delivery slip 1 for writing delivery information on its surface, an IC chip bonded piece 8 provided with two antennas 6, 6 separated across an IC chip arrangement part and two antennas 6a, 6a separated from a non-contact type IC chip 7 across the IC chip 7 on the rear surface of the delivery slip 1 by applying adhesive 9 to parts except the IC chip arrangement part on the rear surface is glued to the rear surface of the delivery slip 1 by the adhesive 9 so that the non-contact type IC chip 7 is positioned in the IC chip arrangement part and the antennas 6, 6, 6a, 6a come into contact mutually, and the adhesive 9 except the glued part of the IC chip bonded piece 8 is covered with a separate paper 10. <P>COPYRIGHT: (C)2007,JPO&INPIT |
