发明名称 ELECTRONIC COMPONENT MOUNTER AND MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounter and mounting method in which suction holding state of an electronic component can be judged accurately and efficiently. <P>SOLUTION: In the electronic component mounter for taking out an electronic component from a component feeding section by vacuum suction and mounting it on a substrate using a mounting head equipped with a suction nozzle, suction state after the electronic component is taken out from the component feeding section by the mounting head is inspected by judging the suction state based on the vacuum pressure in the vacuum suction path from the suction nozzle, or by judging the holding state through component recognition for imaging the electronic component held by the suction nozzle based on data prestored in a data library, and the judgment is used properly depending on the objective electronic component and the aptitude of the suction nozzle. Consequently, suction holding state of the electronic component can be judged accurately and efficiently. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007227492(A) 申请公布日期 2007.09.06
申请号 JP20060044779 申请日期 2006.02.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ATSUTA NARUMI;KAWASE TAKEYUKI;OKUDA OSAMU
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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