| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an improved flexible circuit board for using in an FCoF application, in which a standoff distance between a flip-chip and the flexible circuit board is larger and more uniform than conventional flexible circuit board. <P>SOLUTION: A circuit board for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical trace. The dielectric layer substantially covers the one or more sidewalls of the mounting pad and has an uppermost surface that is substantially coplanar with the second surface of the mounting pad. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
