发明名称 BASE SEMICONDUCTOR CHIP, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device in which arrangement of each function block in a semiconductor substrate can be easily verified, the function blocks can be selectively combined and divided, and further free recombination of connection of the function blocks is enabled. <P>SOLUTION: The semiconductor integrated circuit device comprises: a base semiconductor chip 20 comprising a plurality of function blocks 21 which are separately formed in a specified region in the semiconductor substrate and have pads 22, respectively, for inputting/outputting a signal; and a plurality of wirings 31 which are connected to the pads 22 while disconnection is allowed. Input/output of the signal between the function blocks 21 is carried out with each wiring 31. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007227883(A) 申请公布日期 2007.09.06
申请号 JP20060308793 申请日期 2006.11.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ISHIYAMA YASUHIRO
分类号 H01L21/822;H01L21/82;H01L23/52;H01L25/04;H01L25/18;H01L27/04 主分类号 H01L21/822
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