| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device suppressing pad peeling of a bonding pad portion, and to provide a method of manufacturing the same. <P>SOLUTION: The method of manufacturing the semiconductor device according to the present invention is provided with :a process to form a barrier metal layer 14 on an interlayer insulation film 8, process to eliminate at least part of the barrier metal layer located under a pad opening hole portion, process to form a second aluminum alloy film 15 on the exposed interlayer insulation film 8 and barrier metal layer 14 by the elimination process, process to form a bonding pad portion 17a on the interlayer insulation film by patterning the second aluminum alloy film and barrier metal layer, process to form a passivation film 18 on the bonding pad portion and interlayer insulation film, and process to form the pad opening hole portion located on the bonding pad portion on the passivation film. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
