| 摘要 |
PROBLEM TO BE SOLVED: To prevent the crack of an interlayer insulating layer generated at the time of heat cycle, without causing reduction in peeling strength. SOLUTION: In a multilayer printed wiring board in which the interlayer insulating layer is formed on a conductor circuit of a wiring substrate, the conductor circuit consists of an electroless plated film and an electrolytic plated film, and a coarse layer is provided in at least a part of the surface. COPYRIGHT: (C)2007,JPO&INPIT |
