| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which heat resistance and excellent high frequency characteristics can be achieved simultaneously. SOLUTION: The multilayer printed wiring board 10 includes a laminate structure unit 16 where one insulation layer 14a out of two insulation layers 14a, 14b adjoining through a wiring circuit layer 12 is a polyimide resin layer, and the other insulation layer 14b is a liquid crystal polymer layer. The laminate structure unit 16 may spread over the entire laminate structure of the multilayer printed wiring board 10, or one or a plurality of laminate structure units 16 may be provided at suitable portions in the entire laminate structure. Alternatively, a liquid crystal polymer layer may be provided on the side of the liquid crystal polymer layer opposite to the side contiguous to the polyimide resin layer through the wiring circuit layer in the laminate structure unit. COPYRIGHT: (C)2007,JPO&INPIT |
