| 摘要 |
PROBLEM TO BE SOLVED: To provide a power supply wiring structure in which the mean working precision of vias can be acquired and its wiring design method, and an evaluation method for specifying defective parts resulted from the roughness/fineness of the vias in a short time in a multi-layer wiring technology. SOLUTION: This semiconductor device is provided with a plurality of circuit cell power supply wiring 1 and circuit cell ground wiring 2 arranged so as to be lined up in a first direction on a substrate having a plurality of circuit cells 7; a plurality of base power supply wiring 3 and base ground wiring 4 arranged so as to be lined up in a second direction crossing the first direction, in such a status that wiring widths W1, W2 and W3 are made thinner according as they are made closer to the outer periphery of a circuit cell arrangement region (a), in the upper layer of the circuit cell power supply wiring 1 and the circuit cell ground wiring 2; a plurality of first vias 5 connecting the circuit cell power supply wiring 1 to the base power supply wiring 3 crossing this at the upper part; and a plurality of second vias 6 connecting the circuit cell ground wiring 2 to the base ground wiring 4 crossing this at the upper part. COPYRIGHT: (C)2007,JPO&INPIT
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