发明名称 HEAT TREATMENT APPARATUS OF SUBSTRATE, AND HEAT TREATMENT METHOD OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus and heat treatment method of substrate which can heat the substrate such as a glass substrate or the like efficiently. SOLUTION: The heat treatment apparatus of the substrate comprises a gas passageway 30 making a gas for temperature control pass along an upper surface and lower surface of substrate G. A heating element 41 generating heat by energizing is arranged along an interior of this gas passageway 30. A plurality of discharge openings 31, 32 discharging the gas for the temperature control from the gas passageway 30 is arranged in parallel along a gas supply path. The gas for the temperature control within the gas passageway 30 is heated by a heat generation of the heating element 41. A tube 20 constituting the gas passage way 30 and the substrate G are heated by the gas for the temperature control. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007227773(A) 申请公布日期 2007.09.06
申请号 JP20060048678 申请日期 2006.02.24
申请人 TOKYO ELECTRON LTD 发明人 KITAMURA MASAYUKI
分类号 H01L21/324;G02F1/13;G02F1/1333;H01L21/22 主分类号 H01L21/324
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