| 摘要 |
PROBLEM TO BE SOLVED: To provide a package substrate that has convenience for filling an underfill material from a filling hole of a printed wiring board while improving mechanical strength and heat dissipation properties. SOLUTION: The package substrate is provided with a semiconductor chip 10; the printed wiring board 20 in which the semiconductor chip 10 is mounted on a wiring pattern 22 provided on the surface of the printed wiring board, in which a reinforcing plate 24 is arranged on the rear face opposite to the face mounted with the semiconductor chip 10, and which has the filling hole 26 at a part of the portion mounted with the semiconductor chip 10; the underfill material 30 filled between the semiconductor chip 10 and the printed wiring board 20; and a reinforcing filler 34 filled into the filling hole 26. COPYRIGHT: (C)2007,JPO&INPIT
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