发明名称 Mit Adhäsionshilfsmittel ausgestattete Metallfolie und Leiterplatte, bei der diese verwendet wird
摘要 Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10μm on a metal whose surface has a ten-point average roughness Rz of 2.0μm or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.
申请公布号 DE112005002748(T5) 申请公布日期 2007.09.06
申请号 DE20051102748 申请日期 2005.11.10
申请人 HITACHI CHEMICAL CO. LTD. 发明人 OGAWA, NOBUYUKI;ONOZEKI, HITOSHI;TANABE, TAKAHIRO;TAKAI, KENJI;MORIIKE, NORIO;TAKANEZAWA, SHIN;EJIRI, TAKAKO;KUMAKURA, TOSHIHISA
分类号 H05K1/09 主分类号 H05K1/09
代理机构 代理人
主权项
地址