| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a film carrier tape for mounting electronic components, which is small in initial warpage and does not increase its amount of warpage with time. SOLUTION: The film carrier tape for mounting electronic components has a flexible insulating film, and a wiring pattern which is formed by etching metal foil laminated on one surface of the flexible insulating film. The film carrier tape for mounting electronic components is characterized that, when initial amount of warpage X (however, X is an amount more than 0) measured by the focus depth method is not more than 3% with respect to the tape width and an amount of warpage similarly measured after holding the film carrier tape for mounting electronic components for 120 Hrs under conditions of temperature 25°C and humidity 60% is Y, the amount of warp variation W represented by an equation W=(Y-X)/X is not more than 2.5. It becomes difficult to occur mounting defect of a device and tape conveying defect in mounting by using the film carrier tape. COPYRIGHT: (C)2007,JPO&INPIT
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