| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a core layer and a multilayer substrate which are effective for reduction of a raw cost, and their manufacturing method. <P>SOLUTION: A core layer which includes a nickel layer as a seed layer and can form a fine inner circuit by a semi-additive method by improving combination force between a core insulating layer or an insulating layer such as prepreg and a conductive layer such as a copper layer, can reduce the number of layers of a substrate to be laminated since a fine interconnection can be formed directly in the core layer, can thin the substrate since the thickness of a formed electroless nickel plating layer can be reduced, thus improving productivity, and can reduce a raw cost, a multilayer substrate and their manufacturing method are provided. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
