发明名称 MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an MEMS (Micro Electro Mechanical System) device and a manufacturing method of an MEMS device, easily air-tight sealing an MEMS structure in a simple process. <P>SOLUTION: This MEMS device includes: an MEMS structure 30 including fixed parts 4a, 4b and a movable part 7 and formed on a semiconductor substrate 1; a wiring layer 8 in which wiring 16 connected to the MEMS structure 20 is stacked through an insulating film, which is formed to surround the MEMS structure 20; and a silicon nitride film 10 continuous from the upside of the wiring layer 8 to the upside of the MEMS structure 20 and having a plurality of opening parts 13, wherein a cavity part 14 is demarcated between the semiconductor substrate 1 and the silicon nitride film 10, and the opening parts 13 of the silicon nitride film 10 are blocked to air-tightly seal the interior of the cavity part 14. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007222956(A) 申请公布日期 2007.09.06
申请号 JP20060043479 申请日期 2006.02.21
申请人 SEIKO EPSON CORP 发明人 WATANABE TORU;SATO AKIRA;INABA SHOGO
分类号 B81B3/00;B81C3/00;H01L23/02 主分类号 B81B3/00
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