| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which can present a metal foil clad laminate for print wiring boards having a low dielectric constant, low water absorption, a high glass transition temperature (Tg), excellent in insulation reliability and heat resistance and giving little roughness in a holed wall and little abrasion of a drill blade during drilling, and a prepreg and a metal foil clad laminate for print wiring boards. SOLUTION: The resin composition is prepared by blending a phenol-modified cyanate ester oligomer (A) prepared by reacting a cyanate compound containing≥2 cyanate groups in a molecule (a<SB>1</SB>) with a phenol compound (a<SB>2</SB>) with an epoxy resin (B) containing≥2 epoxy groups in a molecule and has 0.01-0.03 equivalent ratio of the phenol compound (a<SB>2</SB>) to a cyanate group of the cyanate compound (a<SB>1</SB>). The prepreg and the metal foil clad laminate for print wiring boards are provided. COPYRIGHT: (C)2007,JPO&INPIT
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