发明名称 |
APPARATUS FOR FORMING TRANSITION METAL OXIDE FILM, METHOD OF MANUFACTURING NONVOLATILE MEMORY DEVICE USING SAID APPARATUS, NONVOLATILE MEMORY DEVICE MANUFACTURED BY SAID METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for forming a transition metal oxide film, a method of manufacturing a nonvolatile memory device using the apparatus, and a nonvolatile memory device manufactured by the method. <P>SOLUTION: An apparatus for forming a transition metal oxide film, a method of manufacturing a nonvolatile memory device, and a nonvolatile memory device manufactured by the method are provided. The apparatus for forming a transition metal oxide film comprises: a chamber; a substrate which is placed in the chamber, and on which a transition metal oxide film is formed; a target which is placed in the chamber and discharges transition metal particles that are a first source material of the transition metal oxide film toward the substrate; and an oxygen ion gun which accelerates oxygen ions that are a second source material of the transition metal oxide film and radiates the accelerated oxygen ions toward the substrate. The method of manufacturing a nonvolatile memory device comprises: a step of discharging transition metal particles from the target; a step of accelerating oxygen ions and radiating them toward the substrate with the oxygen ion gun; and a step of reacting the transition metal particles and the oxygen ions on the substrate to deposit a resultant transition metal oxide film on the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007227898(A) |
申请公布日期 |
2007.09.06 |
申请号 |
JP20070002445 |
申请日期 |
2007.01.10 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
RI SHOKEN;BANG SANG-BONG;CHOI SANG-JUN;JO HANSHAKU;LEE CHANG SOO |
分类号 |
H01L21/31;C23C14/08;C23C14/48;H01L21/316;H01L27/10;H01L45/00;H01L49/00 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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